The connector is mainly based on non-ferrous metals as the basic structural material, especially copper and alloys, and also has high requirements on the hardness and wear resistance of the gold plating layer. Therefore, the hardness of the gold plating liquid is often added to increase its hardness. Metal components, but the added amount is very small, is added in the form of additives, can be understood as inorganic additives, commonly used are nickel, cobalt, antimony and other metal salts, the better the performance is mainly cobalt salt, its typical The gold plating process is as follows:
