Substrate, epitaxy, and chip technologies continue to break through . There are 142 chip companies in the world, and 36 companies have been put into production in China. There are about 2,800 MOCVDs in the world, and there are more than 700 in China, with about 400 units in operation. In 2011, the global chip production was 82 billion, and it is expected to reach 95 billion in 2012, with a chip capacity surplus of 35%. At present, Baiguang's laboratory light efficiency can reach 254 lm/W, industrialization is 140-150 lm/W, and recently Cree has launched 160 lm/W products. At the same time, the blue light effect reaches 300lm/W, the red light effect reaches 240 lm/W, and the green light effect reaches 160lm/W. Graphical substrates (orientation, nano) and semi-polar, non-polar substrates have achieved good results by improving processes, simplifying processes, saving raw materials, and reducing costs. The method of producing a GaN substrate and growing a GaN LED on a GaN substrate greatly reduces the amount of MO source and high purity gas, and it is predicted that the cost can be reduced by 50%. GaN is grown on 8-inch Si substrates, and many companies around the world have invested in research and development. Due to the availability of existing redundant production equipment and streamlined processes, the cost will be significantly reduced. At the same time, Aixtron has introduced an epitaxial furnace based on Si, which can strictly control the bending degree and produce it uniformly. This will undoubtedly drive the process of epitaxial growth on 8-inch Si substrates and significantly reduce costs. Japan's NG's new epitaxial technology has greatly improved the LED performance index due to the large reduction in dislocation density, and has made breakthrough progress. In terms of chip structure, a variety of new structures have emerged, typically hexahedral light-emitting chips, and multi-face surface roughening technology is used to reduce interface reflection and increase light extraction rate, thereby improving external quantum efficiency. Samsung's LEDs using nano-scale hexagonal pyramid structure technology can achieve semi-polar, non-polar growth of GaN, good heat dissipation, good crystal quality, and achieve multi-color white LEDs, making breakthroughs. According to relevant reports, comprehensively, many of the major technological innovations of epitaxy and chips are aimed at key technical issues of improving performance and reducing costs. Therefore, institutional experts have analyzed and predicted that the epitaxic cost will be 25% per year in the next 10 years. reduce. In summary, due to the continuous breakthrough of GaN epitaxy and chip technology, low-dislocation GaN can be grown and high-efficiency LEDs can be made by using different substrates, new structures and nano-scale technologies. In the absence of wavelength conversion, the luminous efficacy can exceed 300lm / W (the theoretical value can reach 400lm / W); when using the wavelength conversion of the phosphor, the luminous efficiency can exceed 200lm / W (the theoretical value can reach 263lm / W), Develop a new technology route for multi-color single-chip. At the same time, the use of new technology and large wafer technology to grow epitaxy can significantly reduce the cost of epitaxy and chip fabrication. Modular standard packaging into the development direction China's LED packaging technology has made great progress in recent years, the overall packaging level is very small, even equivalent, but the key packaging materials are still imported. In 2011, the global packaged device output value was US$12.5 billion, with a growth rate of 9.8%. Another reported output value was US$11.2 billion and US$13.78 billion. However, due to the underestimation of these packaging industries in China (less than US$1 billion), the global The package output value should actually be around $16 billion. The top ten packaging companies in the world are Nichia, Samsung, Osram, LG, Seoul Semiconductor, Cree, Philips, Sharp, Toyota Synthetic, and Everlight, accounting for 68% of the global market. China's packaged devices have an output value of about 25 billion yuan, and more than 40 companies with an output value of more than 100 million yuan. The device's luminous efficiency is 120-130 lm/W, and imported chips can reach 140-150 lm/W. In order to improve light extraction efficiency, package reliability and reduce cost, the industry has made great progress in using SMC composite materials, DMS high-conductivity materials, various ceramic materials, phosphor coating processes and new packaging structures. New technologies such as new phosphors, graphene heat dissipation, and quantum dots are emerging. China's independent innovation of a variety of new COB structures has many advantages, and can reduce costs by 10% to 30%. At present, the COB light efficiency has reached 130-150 lm/W. At the same time, the chip, the drive, the control part, the heat dissipation, the parts and the like are packaged together to form a module, and the modular standard package LED product for standardized production becomes the development direction of the semiconductor illumination source. The Zhaga Alliance has developed more than a dozen draft standards for this purpose, primarily the Light Engine Interface Interface Standard, which includes physical dimensions, optical, electrical and thermal characteristics. Some experts predict that due to the use of direct eutectic soldering and modular standard packaging technology, in another 5 to 10 years, LED packaging companies will no longer need to package LED lighting devices, but will be packaged and assembled by lighting companies. According to relevant reports, due to the extension of the epitaxy and the significant cost reduction of the chip, the packaging adopts new technology, which will further reduce the cost. Therefore, some organizations predict that the price of LED devices will decrease at an average rate of 20% in recent years. In summary, the packaging technology adopts new structures, new processes and nano-scale technologies, and has made breakthrough progress. In the future, it is possible to adopt a packaging technology that replaces phosphors, and adopts a modular package in the field of illumination, which does not require separate packaging of LEDs. Applications may use products with different packaging technologies. Therefore, the cost of the device will be greatly reduced, and the enterprise must be able to withstand it. Prospects for lighting application market are promising With the continuous improvement of LED performance, the scope of LED lighting applications has been continuously expanded, which has promoted the rapid development of the semiconductor lighting industry. In 2012, the global total output value of lighting was 140 billion US dollars, of which LED lighting accounted for 11%, which was 15.4 billion US dollars. In 2011, China's LED lighting production was 180 million, of which bulbs accounted for 47.4%, spotlights accounted for 22.8%, straight tube lamps 12.1%, and downlights 7.3%. In the first three quarters of 2012, LED lamp exports increased by 40%, and the market prospects are promising. In terms of energy efficiency, although the current theoretical value can reach 56%, the actual total energy efficiency is only 20% to 30%. To achieve a total energy efficiency of more than 50%, there are still many technical problems to be solved, and the difficulty is also great. In terms of life, LED chips can last for hundreds of thousands of hours, and devices can reach 50,000 to 100,000 hours. The Energy Star Lighting V1.0 technical specification stipulates that the life expectancy of integrated LED lamps is 15,000 to 25,000 hours. In terms of comfort and safety, relevant standards are also being developed. In the era of LED lighting, enterprises should give full play to the advantages of LED lighting and comprehensively transform and innovate traditional lighting fixtures. Increase the intensity of designing new luminaires, such as recessed lighting, flat lighting, strip lights, flexible light sources, art lights, etc., to make the lighting environment softer, more comfortable and more personalized. In terms of intelligent digital control, indoor intelligent lighting system is suitable for commercial lighting and home lighting; outdoor intelligent lighting system is suitable for landscape lighting, public buildings and road system lighting; professional intelligent lighting system is suitable for art lighting in specific places. The Global Connected Lighting Alliance was launched in September 2012 by six lighting giants (Philips, Osram, Panasonic, Toshiba, GE, Lutron) to promote the implementation of lighting wireless network control systems. Through intelligent digital control, the individualization, comfort, dimming, color adjustment and secondary energy saving of lighting will be realized, which is the development direction of the lighting system. In the development of ecological agriculture, LED light source can be applied to plant growth, livestock and poultry breeding, pest control and so on. Developed countries and major LED companies have been involved in the application of this field. In summary, the final energy efficiency goal of LED lighting products will reach more than 50%. The quality of light source should meet the requirements of comfort and safety. LED lighting fixtures should be fully innovated to meet the needs of modern LED lighting. The application of intelligent control system will be lighting. The direction. In addition, we must pay attention to the application of LED lamps in the field of non-lighting.
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