After the photovoltaic "531", the mission of the diamond line

Abstract "Whether it is for a company or an industry, technology is always a crushing stone. As long as the technology develops forward, any difficulties can be overcome." Song Dengyuan, director of the State Key Laboratory of Photovoltaic Materials and Technology, recently "2018PVTD" The diamond line era - crystal...

"Whether it is for a company or an industry, technology is always a crushing stone. As long as the technology develops forward, any difficulties can be overcome." Song Dengyuan, director of the State Key Laboratory of Photovoltaic Materials and Technology, recently "2018PVTD King Kong" The line era - the seminar on optimization of crystal silicon reduction and efficiency improvement process, said.

The "531 New Deal" has caused Chinese PV companies to fall into the midst of falling and falling prices of various products. After experiencing overcapacity and market downturn, PV companies have returned the strategic focus of technology research and development to “reducing costs and improving efficiency”. The cutting edge of the silicon wafer has become the starting point of photovoltaic enterprises.

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The new way to reduce the front end

"From the perspective of future development trends, crystalline silicon is still the mainstream of materials in 5-10 years." Jin Shanming, vice president of GCL-Poly Slice Division, told reporters that "as long as this fact does not change during a certain period of time, then the diamond cutting process will not Will be replaced."

In fact, the reference to the "King Kong Line era" was just emerging last year. In 2014, the diamond wire process was first popularized in domestic single crystal enterprises. At that time, the black silicon technology applied to polycrystalline silicon wafers did not reach the mature standard of industrialization. Until 2017, polycrystalline began to turn to diamond wire cutting. "When companies use diamond wire cutting technology on polycrystalline, it is considered to have the 'Kinggang line era'." Jin Shanming said.

However, according to the statistics of the China Photovoltaic Industry Association, in 2017, the wafer end of the photovoltaic industry is still based on traditional mortar cutting. Among the 38 wafer companies that were included in the statistics last year, diamond wire cutting accounted for 37.5%. Wang Bohua, secretary-general of China Photovoltaic Industry Association, said: "In the first half of 2018, wafer companies will usher in a large-scale replacement of cutting equipment. It is expected that diamond cutting will become the mainstream process of polysilicon chipping this year."

This is really good news for the PV industry's goal of “flat price online, cost reduction and efficiency increase”. According to the relevant technical personnel in the industry, compared with traditional mortar cutting, diamond wire cutting has obvious advantages. On the one hand, diamond cutting can reduce the silicon consumption by at least 18%, and quickly reduce the cutting cost of more than 1 yuan to 0.6-0.7 yuan, a drop of more than 30%. On the other hand, the diamond wire process can also reduce energy consumption and be more environmentally friendly. The average daily electricity consumption of enterprises can be reduced by 150-1700 degrees, and water consumption is reduced by more than 6 tons. At the same time, due to the reduction of the introduction of organic matter, the sewage treatment cost will be correspondingly reduced, and the silicon wafer using the diamond wire process cutting technology has a shallow surface damage and is easy to clean.

Troika promotes development

Lv Jinbiao, vice president of GCL-Poly, previously said that the biggest advantage of diamond wire cutting is cost performance. It only needs a small amount of transformation cost to increase production capacity, thereby enhancing competitiveness and benefiting the entire industry chain. At this seminar, Jin Shanming once again pointed out that for the ultimate goal of “reducing costs and improving efficiency, and surfing the Internet at a low price”, the price/performance ratio is the core and the king. “The process of chasing the price-performance ratio is actually that every company races on the road of cost reduction. Therefore, even if the diamond line technology completely replaces the mortar cutting in a short period of time, it does not mean that this matter is over. There is still great progress in the diamond cutting. space."

“With the gradual promotion of diamond cutting, and the changes in some battery solutions, thinning is an inevitable trend in the future.” Jin Shanming said, “Now we have 180 micron polycrystalline products with a ratio of 30%-40%, 170 Micron is also doing. Single crystals go further in this respect."

"At present, the single crystal N type can be made to 140 microns, and the cost is about 4 hairs," said Cheng Xu, manager of the Qingdao High Test Technology Cutting R&D Testing Center.

At the same time, the experts at the meeting believed that in addition to the thinning, the diamond wire cutting will also develop in the two directions of thinning and improving the performance of the cutting machine equipment, and the troika promotes development.

Yu Ming, director of the silicon wafer business unit of Zhejiang Yuhui Sunshine Energy Co., Ltd. said: “The company is doing thin line because it can increase the filming rate, reduce silicon consumption and reduce cost.”

However, due to the excessive wear rate of the wire, some obstacles have been encountered in the thinning. "Currently, the single crystal is cut at 50-60 microns, and the polycrystal is basically maintained at 60 microns. No one knows how to go down." Jin Shanming told reporters, "The thin line is a unique feature of diamond cutting. First, it must be continued."

Yu Ming said that the thinner the line is, the greater the challenge of indicators such as wire breakage rate and tensile strength. “There is a company that can do 10-20 microns or even a few microns. This idea is very good, but if you want to mass production, you still have to face realistic problems. If you pursue a thinner line, the final cost will not necessarily drop. Come down."

It is worth mentioning that the thin line involves not only the problem of the line, but also the corresponding support in the cutting machine equipment, such as improving power, stability, precision, speed, etc., to ensure the cutting ability of fine particles. At the same time, it will increase the installed capacity. "This is a reason to play the game, 'weapons and equipment' is very important." Yu Ming said.

Intelligent expectations

Due to the high technical requirements of the diamond cutting process, the labor costs in the industry remain high. "Especially the labor cost in East China is very high, and the monthly salary of the slicer has been more than 10,000 yuan." Peng Xu said helplessly, "and the development of automation will help to achieve this cost reduction."

Yu Ming also believes that automation and intelligentization instead of manual operation are the major trends in the future.

A number of relevant person in charge of the enterprise said that many enterprises on the component side now have no-manufacturers, and the development of front-end silicon material processing is relatively backward, but I believe that the future situation will be better.

"At present, there is indeed a situation in which the number of engineers is reduced, and the rate of good indicators is decreasing and the breakage is obviously rising." "There is a desire to cut silicon wafers through the combination of 'King Kong line + slicer + intelligent'. Cost reduction is an effective technical support."

Chen Xu pointed out that the construction of intelligent factories must start from the equipment layer, improve equipment performance, and gradually automate from the cutting machine to the slicer. Then, these automation groups are serialized, and then the data is collected through the acquisition layer. Finally, the integration of mechanical learning and big data control is used to achieve the goal of intelligent workshop. “Recently, we have introduced new equipment with high line speed and high speed, which can greatly increase production capacity. The slicing plant with a capacity of 1GW has been reduced from 40 units to 15 units. It is expected to be continuously developed. On the basis of this, the capacity will be reached in the next 10 units."

When it comes to the automation and intelligent future implementation path, the participating technical experts have said that the manual intervention and the machine independent learning method should be carried out simultaneously, sticking to two legs.


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